Click or drag to resize

SolderPasteMeasurement Properties

[This is preliminary documentation and is subject to change.]

The SolderPasteMeasurement type exposes the following members.

Properties
  NameDescription
Public propertyComponentPad
The specific component lead / pad related to this measurement (eg. "R31.2", "C2.1")
Public propertyDepositImage
An optional image of the deposit formatted in an acceptable MIME image format (JPG, PNG, etc.)
Public propertyPasteHeight
The height of the paste deposition. Includes the expected deposition height in the ExpectedValue property.
Public propertyPasteVolume
The volume of the paste deposition. Includes the expected deposition volume in the ExpectedValue property.
Public propertyPasteXOffset
The x location of the center of the paste deposition relative to the center of the pad.
Public propertyPasteXSize
The x dimension (length) of the paste deposition. Includes the expected deposition length in the ExpectedValue property.
Public propertyPasteYOffset
The y location of the center of the paste deposition relative to the center of the pad.
Public propertyPasteYSize
The y dimension (width) of the paste deposition. Includes the expected deposition width in the ExpectedValue property.
Top
See Also