SolderPasteMeasurement Class |
[This is preliminary documentation and is subject to change.]
Namespace: CFX.Structures.SolderPasteInspection
The SolderPasteMeasurement type exposes the following members.
| Name | Description | |
|---|---|---|
| ComponentPad |
The specific component lead / pad related to this measurement (eg. "R31.2", "C2.1")
| |
| DepositImage |
An optional image of the deposit formatted in an acceptable MIME image format (JPG, PNG, etc.)
| |
| PasteHeight |
The height of the paste deposition. Includes the expected deposition
height in the ExpectedValue property.
| |
| PasteVolume |
The volume of the paste deposition. Includes the expected deposition
volume in the ExpectedValue property.
| |
| PasteXOffset |
The x location of the center of the paste deposition relative to the center of the pad.
| |
| PasteXSize |
The x dimension (length) of the paste deposition. Includes the expected deposition
length in the ExpectedValue property.
| |
| PasteYOffset |
The y location of the center of the paste deposition relative to the center of the pad.
| |
| PasteYSize |
The y dimension (width) of the paste deposition. Includes the expected deposition
width in the ExpectedValue property.
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